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110KV High-Resolution X-ray Unicomp AX8300 for Non-Destructive BGA Solder Joint Analysis
110KV High-Resolution X-ray Unicomp AX8300 for Non-Destructive BGA Solder Joint Analysis
  • 110KV High-Resolution X-ray Unicomp AX8300 for Non-Destructive BGA Solder Joint Analysis
  • 110KV High-Resolution X-ray Unicomp AX8300 for Non-Destructive BGA Solder Joint Analysis
  • 110KV High-Resolution X-ray Unicomp AX8300 for Non-Destructive BGA Solder Joint Analysis
  • 110KV High-Resolution X-ray Unicomp AX8300 for Non-Destructive BGA Solder Joint Analysis
Products Detailed
High Resolution Semiconductor X-Ray Inspection Machine AX8300 AX8300 adopts self-developed 110kV high-power micro-focus X-ray source with ultra-fine 2...
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