Unicomp Technology

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Unicomp AX9100max Electronics X Ray Machine FOR Flip-Chip BGA (FCBGA)

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Unicomp Technology
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City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Person:MrJames Lee
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Unicomp AX9100max Electronics X Ray Machine FOR Flip-Chip BGA (FCBGA)

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Brand Name :UNICOMP
Model Number :AX9100max
Certification :CE, FDA
Place of Origin :China
MOQ :1 set
Price :can negotiate
Payment Terms :L/C,T/T
Supply Ability :100set/montrh
Delivery Time :15 days
Packaging Details :Unicomp Wood.
Voltage :130kV
Movement Control :Mouse & Keyboard & Dual joystick
Max. Loading Area :Φ620[mm]
Max. Inspection Area :450*600[mm]
Tilt and Rotation :Rotate the swing arm up to 60°
Table :Plane rotation 360°
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Unicomp AX9100max Electronics X Ray Machine FOR Flip-Chip BGA (FCBGA)

The Unicomp AX9100max X-ray Inspection Systemis engineered specifically for IGBT module analysis and serves a broad range of industries, including:

BGA/CSP/Flip Chip packaging

LED & optoelectronic components

Fuse & diode manufacturing

PCB & semiconductor assembly

Battery production

Small metal castings

Electronic connector modules & cables

Photovoltaic (PV) cell inspection


Application Fields
Unicomp AX9100max Electronics X Ray Machine FOR Flip-Chip BGA (FCBGA)
Application fields of Unicomp AX9100max X-ray Machine

Functions and Features
Unicomp AX9100max Electronics X Ray Machine FOR Flip-Chip BGA (FCBGA)
Functions and features of Unicomp AX9100max X-ray Machine
Inspection Image
Unicomp AX9100max Electronics X Ray Machine FOR Flip-Chip BGA (FCBGA)












Sample inspection image from Unicomp AX9100max X-ray Machine

Technical Parameters and Specifications
Unicomp AX9100max Electronics X Ray Machine FOR Flip-Chip BGA (FCBGA)





































Technical specifications of Unicomp AX9100max X-ray Machine

Dimensions and Appearance
Unicomp AX9100max Electronics X Ray Machine FOR Flip-Chip BGA (FCBGA)
























Dimensions and appearance of Unicomp AX9100max X-ray Machine
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