Unicomp Technology
X-ray Intelligent Detection System Integrator Equipment+Cloud Tracking Platform
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X-Ray Inspection Equipment for IC
Description of IC X Ray machine AX7900:
It has extensive applications in diverse fields such as BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Production, Miniature Metal Casting, Electronic Connector Assemblies, Wiring, Aerospace Parts, and Photovoltaic Industry, to name a few.
FEATURES of IC Xray machine AX7900:
Technical Specifications of AX7900
| Item | Definition | Specs |
| System Parameters | Size | 1280(L)x1220(W)x1615(H)mm |
| Weight | 1100kg | |
| Power | AC 110/220V, 50/60Hz | |
| Power Consumption | 1.0kW | |
| X-ray Tube | Type | Sealed |
| Max.Voltage | 0~90kV (Adjustable) | |
| Max.Power | 8W | |
| Spot Size | 5μm | |
| X-ray System | Intensifier | FPD |
| Monitor | 224‘’LCD | |
| System Magnification | 600X | |
| Detection Region | Max.Loading Area | 520mm x 420mm |
| Max.Inspection Area | 460mm x 400mm | |
| X-ray Leakage | <1μSv/h (Meets All International Standards) | |
Inspection Images of IC X Ray machine AX7900:
