Unicomp Technology
X-ray Intelligent Detection System Integrator Equipment+Cloud Tracking Platform
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High specifications electronic boards 2D & 2.5D X-ray machine Unicomp AX7900 for used cellphone quality inspection and cracks checking
Description of IC X Ray machine AX7900:
It is widely used in various fields, including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Production, small-scale metal casting, electronic connector modules, cables, aerospace components, as well as the photovoltaic industry, among others.
FEATURES of IC Xray machine AX7900:
Technical Specifications of AX7900
| Item | Definition | Specs |
| System Parameters | Size | 1280(L)x1220(W)x1615(H)mm |
| Weight | 1100kg | |
| Power | AC 110/220V, 50/60Hz | |
| Power Consumption | 1.0kW | |
| X-ray Tube | Type | Sealed |
| Max.Voltage | 0~90kV (Adjustable) | |
| Max.Power | 8W | |
| Spot Size | 5μm | |
| X-ray System | Intensifier | FPD |
| Monitor | 224‘’LCD | |
| System Magnification | 600X | |
| Detection Region | Max.Loading Area | 520mm x 420mm |
| Max.Inspection Area | 460mm x 400mm | |
| X-ray Leakage | <1μSv/h (Meets All International Standards) | |
Inspection Images of IC X Ray machine AX7900:
