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X-Ray Inspection Equipment for Electronics
Description of IC X Ray machine AX7900:
Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal
Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc.
APPLICATION of IC Xray machine AX7900:
FEATURES of IC Xray machine AX7900:
Technical Specifications of AX7900
Item | Definition | Specs |
System Parameters | Size | 1280(L)x1220(W)x1615(H)mm |
Weight | 1100kg | |
Power | AC 110/220V, 50/60Hz | |
Power Consumption | 1.0kW | |
X-ray Tube | Type | Sealed |
Max.Voltage | 0~90kV (Adjustable) | |
Max.Power | 8W | |
Spot Size | 85μm | |
X-ray System | Intensifier | FPD(Flat Panel Detector) |
Monitor | 22 ‘’LCD | |
System Magnification | 160 X/360X | |
Detection Region | Max.Loading Size | 440mm x 400mm |
Max.Inspection Area | 420mm x 380mm | |
X-ray Leakage | <1μSv/h |
Inspection Images of IC X Ray machine AX7900: