Unicomp Technology
X-ray Intelligent Detection System Integrator Equipment+Cloud Tracking Platform
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Unicomp high quality 130KV inline Unicomp LX9200 3D CT X-Ray computed temography machine for PCB BGA inspection
Unicomp Technology 3D Inline X-ray Inspection Equipment——LX9200
As a new generation of upgraded and optimized LX9200 online inspection equipment, it can easily meet the multi-directional and multi-angle product inspection needs of different users.
Application Field
| SMT/PCBA | Package type: BGA, LGA, CSP, POP, SIP... Defect type: Void, HIP, Insufficient, Bridge... |
| Semiconductor | Package type: W/B, IC, F/C... Defect type: Void, Open, Short, Sweep, Solder ball... |
| Other areas | Battery, IGBT... |
Technical Parameters and Specifications
| System Summary | |
| Footprint | 1640(W)*2070(D)*1800(H)mm |
| Machine Weight | ≈3450kg |
| Power Supply | 220AC/50Hz |
| Power | 5.5 kW |
| X-ray Leakage | < 0.5µSv/h |
| Imaging System | |
| Tube Type | Closed |
| Max. Voltage | 130kV |
| Detector | FPD |
| Image Acquisition | 2D/2.5D/3D |
| Inspection Area | |
| Max. Inspection Area (M Size) | 255*330mm |
| Max. Inspection Area (L Size) | 440*550mm |
| Max.Inspection Area (XL Size) | 610*1200mm |
| PCBA thickness | 0.5~5mm |
| PCBA Craft side | 5mm |
| PCBA warpage compensation | ±2mm |
| Clearance Top | 70mm |
| Clearance Bottom | 40mm |
| * Specifications are subject to change without notice, All trademarks are the property of the system maker. | |
Inspection images
Function Features
2D, 2.5D, and 3D all in one Inline X-Ray Inspection System
Multiple Resolution Selected (Max. 6μm)
130KV Closed Micro-focus X-Ray Generator
Real-time image with HD FPD Detector
11-axis Linkage System
360° Circular CT Image
Data Tracking and Reworking System Embedded