Unicomp Technology
X-ray Intelligent Detection System Integrator Equipment+Cloud Tracking Platform
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Factory directly supply microfocus inline 2D X-ray machine to check Electronic Semiconductor IGBT with automatic defect recognition
Technical Parameters and Specifications
| System Summary | |
| Footprint | 2595(W)×1392(D)×1992(H)mm |
| Machine Weight | 1900 kg (X-Ray) / 700kg (Conveyor) |
| Power Supply | AC 110~220V, 50/60Hz |
| Plywood Packing Size | 180(W)×170(D)×190(H)cm (X-Ray) 150(W)×105(D)×120(H)cm (Conveyor) |
| Packing Weight | 2000kg (X-Ray) / 800kg (Conveyor) |
| Power Consumption | 3.5 kW |
| X-Ray Tube | |
| Tube Type | Sealed |
| Max. Power | 8W |
| Voltage | 0~90kV (Adjustable) |
| Focus Spot Size | 5μm |
| Imaging System | |
| Detector | Flat Panel Detector (FPD) |
| Pixel Size | 85μm |
| Effective Detection Area | 130*130mm |
| Frame Rates | 20fps |
| Pixel Matrix | 1536*1536 |
| System Magnification | 200X |
| Software | |
| Auto-measuring | Auto Inspection and Analysing for Ok & NG Components |
| CNC Mode | CNC Programmable Inspection, Easy Operation and User Friendly |
| Rework | Support Rework Database Management System |
| Data Connection | Support MES/ERP/SPC System |
| Navigation | Convenient Target Point Positioning System |
| Motion Control System | |
| Movement Control | Joystick, Keypad, Mouse & Touch Panel (PLC) |
| Adjustable Tunnel width | 80~350mm |
| Max. Inspection Sample | 400*350mm / 10kg |
| Min . Inspection Sample | 100*80mm |
| Manipulator | Auto Inline System |
| Industrial PC | |
| Monitor | 22’’ FHD LCD Display |
| System OS | Windows 10 64bit |
| Hard disk | 1TB |
| RAM | 8GB |
| CPU model | Intel i7 Processor |
| Other Features | |
| Energy Saving | X-Ray Auto-off when it's out of work over than 5 minutes |
| Safety Operation | Electromagnetic Interlock, Warning Light |
| Authority Management | Password Magnagement |
| X-Ray Safety | <1μSv/h (Meets All International Standards) |
| * Specifications are subject to change without notice, All trademarks are the property of the system maker. | |
This X-ray is designed to provide high-resolution X-ray imaging for the electronics industry. This versatile system is effective for many applications in the PCB manufacturing process. This includes BGA, CSP, QFN, flip chip, COB and various SMT components. is a powerful support tool for process development, process monitoring and refinement of rework operations. Backed by a powerful and easy-to-use software interface, x ray is able to meet the needs of small and large factories.
Functions and Features
Inspection images
Application
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small
Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc.