Unicomp Technology
X-ray Intelligent Detection System Integrator Equipment+Cloud Tracking Platform
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Digital Radiography machine & x ray machine Unicomp AX7900 for pcb repair and IC/BGA ball soldering measurement&testing
Description of IC X Ray machine AX7900:
It is widely adopted across multiple industries, including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB manufacturing, Semiconductor production, Batteries, Small Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, and Photovoltaics.
FEATURES of IC Xray machine AX7900:
Technical Specifications of AX7900
| Item | Definition | Specs |
| System Parameters | Size | 1280(L)x1220(W)x1615(H)mm |
| Weight | 1100kg | |
| Power | AC 110/220V, 50/60Hz | |
| Power Consumption | 1.0kW | |
| X-ray Tube | Type | Sealed |
| Max.Voltage | 0~90kV (Adjustable) | |
| Max.Power | 8W | |
| Spot Size | 5μm | |
| X-ray System | Intensifier | FPD |
| Monitor | 224‘’LCD | |
| System Magnification | 600X | |
| Detection Region | Max.Loading Area | 520mm x 420mm |
| Max.Inspection Area | 460mm x 400mm | |
| X-ray Leakage | <1μSv/h (Meets All International Standards) | |
Inspection Images of IC X Ray machine AX7900:
