Unicomp Technology
X-ray Intelligent Detection System Integrator Equipment+Cloud Tracking Platform
Add to Cart
Benchtop Electronics PCBA micro-focus BGA X Ray Inspection Machine
OUR SERVICE
1.Your inquiry will be replied in 12 hours.
2.Original Manufacture to customers, with competitive price.
3.We provide one year warranty, free training and whole life technology support.
4.We can arrange the shipment by air, DHL,Fedex, UPS, and by Sea,etc for you,
and will give you the tracking NO. after shipment.
5.Well-trained and Professional after-sales service team to support you.
6.Manual will package with machine . It will show you how to use machine step by step.
7.Items are only shipped after payment is received.
| Item | Definition | Specs |
| System Parameters | Size | 750(L)x570(W)x890(H)mm |
| Weight | 300kg | |
| Power | 220AC/50Hz | |
| Power Consumption | 0.5kW | |
| X-ray Tube | Type | Closed |
| Max.Voltage | 100kV | |
| Max.Power | 200μA | |
| Spot Size | 5μm | |
| Detector | Intensifier | FPD |
| X-ray Coverage | 48mm x 54mm | |
| Resolution | 208Lp/cm | |
| Work Station | Max.Loading Size | 200mm x 200mm |
| Max.Inspection Area | 200mm x 200mm | |
| Oblique Angle Views | 360° rotary fixture (Optional) | |
| X-ray Leakage | <1μSv/h | |
X-ray Inspecting Features:
(1) Coverage of process defects up to 97%. Inspectible defects include: Empty solder, Bridge, Solder shortage, voids, components missing, and so on. In particular, the BGA, CSP and other solder joint devices can also be checked by X-Ray.
(2) Higher test coverage. It can check where the naked eye and the online test can not be checked. Such as PCBA was judged fault, suspected PCB inner trace break, X-ray can be quickly checked.
(3) The test preparation time is greatly reduced.
(4) It can observe other means of detection can not be reliably detected defects, such as: Empty soldering, air holes and poor molding and so on.
(5) Double layers board and multi-layer boards only one check (with layered function).
(6) Can provide relevant measurement information, used to evaluate the production process. Such as solder paste thickness, solder joints under the amount of solder.
Inspection Images: