Unicomp Technology
X-ray Intelligent Detection System Integrator Equipment+Cloud Tracking Platform
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Highly flexible semiconductor inspection system PCB X Ray Machine
Description:
90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading area 420mm x 420mm , max. detection area 380 x 380mm, with ~300X System Magnification.
Full Automatic BGA Testing Procedures
1. A simple mouse click programming without the need for operator intervention on the component can detects each BGA automatically.
2. Automatic BGA test, accurately check the bridge, Welding, cold welding and void ratio of BGA.
3. Automatic BGA test repeatable test results in order to process control
4. The test results will be displayed on the screen and can be output to Excel to facilitate review and archiving
NC Programming
1.A simple mouse clicks operation write test procedures
2.The stage can be X, Y director positioning; X-ray tube and detector Z positioning.
3.Software setting voltage and current
4.Image settings: brightness, contrast, auto gain and exposure
5.The user can set the program switch pause time
6.Anti-collision system can meet the maximum tilt and observe objects
| Item | Definition | Specs |
| System Parameters | Size | 1100(L)x1100(W)x1500(H)mm |
| Weight | 1000kg | |
| Power | 220AC/50Hz | |
| Power Consumption | 0.8kW | |
| X-ray Tube | Type | Closed |
| Max.Voltage | 80kV/90kV | |
| Max.Power | 12W/8W | |
| Spot Size | 5μm/15μm | |
| X-ray System | Intensifier | FPD |
| Monitor | 22 ‘’LCD | |
| System Magnification | 160 X/360X | |
| Detection Region | Max.Loading Size | 440mm x 400mm |
| Max.Inspection Area | 420mm x 380mm | |
| X-ray Leakage | <1μSv/h | |
Inspection Images: