Unicomp Technology
X-ray Intelligent Detection System Integrator Equipment+Cloud Tracking Platform
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IC LED Clips Electronic Components Detector Electronics X Ray Machine
X-ray Inspecting Features:
(1) Coverage of process defects up to 97%. Inspectible defects include: Empty solder, Bridge, Solder shortage, voids, components missing, and so on. In particular, the BGA, CSP and other solder joint devices can also be checked by X-Ray.
(2) Higher test coverage. It can check where the naked eye and the online test can not be checked. Such as PCBA was judged fault, suspected PCB inner trace break, X-ray can be quickly checked.
(3) The test preparation time is greatly reduced.
(4) It can observe other means of detection can not be reliably detected defects, such as: Empty soldering, air holes and poor molding and so on.
(5) Double layers board and multi-layer boards only one check (with layered function).
(6) Can provide relevant measurement information, used to evaluate the production process. Such as solder paste thickness, solder joints under the amount of solder.
FEATURES:
90KV 5μm X-ray tube, FPD Detector.
Multi-function workstation, X-Y multi-axis movement. ±60° "Arc" motion(Option).
Motion controls include: X/Y table motion plus Z axis tube and detector movement, ±60° tilt motion (option).
Multi-function DXI image processing system.
X/Y programming function for multiple image inspection routines
Max. loading area 420mm x 420mm, max. detection area 380 x 380mm, with ~300X System Magnification.
BGA void/area auto-measurement plus report generation.