Unicomp Technology

X-ray Intelligent Detection System Integrator Equipment+Cloud Tracking Platform

Manufacturer from China
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7 Years
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BGA Modern X Ray Machine Strong Penetration For Electrical Components

BGA Modern X Ray Machine Strong Penetration For Electrical Components

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Brand Name :UNICOMP
Model Number :AX8200
Certification :CE, FDA
Place of Origin :China
MOQ :1Set
Price :can negotiate
Payment Terms :T/T, L/C
Supply Ability :300 sets per month
Delivery Time :30 days
Packaging Details :Wooden Case, Waterproof, Anti-collision
Application :SMT, EMS,BGA, Electronics, CSP , LED , Flip Chip , Semiconductor
Tube Voltage :100KV
Size :1080(L)x1180(W)x1730(H)mm
X-ray Leakage :< 1uSv/h
Max.Loading Size :510mm x 420mm
Max.Inspection Area :435mm x 385mm
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Electronic and electrical components Chinese BGA X-Ray Inspection Machine

The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework operation. Supported by a powerful and easy to use software interface, the AX-8200 is capable of addressing small and large volume factory requirements. (Contact us for details)


Item

Definition

Specs

System Parameters

Size

1080(L)x1180(W)x1730(H)mm

Weight

1150kg

Power

220AC/50Hz

Power Consumption

0.8kW

X-ray Tube

Type

Closed

Max.Voltage

90kV/100kV

Max.Power

8W

Spot Size

5μm

X-ray System

Intensifier

4"Image Intensifier

Monitor

22"LCD

System Magnification

600x

Detection Region

Max.Loading Size

510mm x 420mm

Max.Inspection Area

435mm x 385mm

X-ray Leakage

< 1uSv/h



X-ray Inspecting Features:

(1) Coverage of process defects up to 97%. Inspectible defects include: Empty solder, Bridge, Solder shortage, voids, components missing, and so on. In particular, the BGA, CSP and other solder joint devices can also be checked by X-Ray.

(2) Higher test coverage. It can check where the naked eye and the online test can not be checked. Such as PCBA was judged fault, suspected PCB inner trace break, X-ray can be quickly checked.

(3) The test preparation time is greatly reduced.

(4) It can observe other means of detection can not be reliably detected defects, such as: Empty soldering, air holes and poor molding and so on.

(5) Double layers board and multi-layer boards only one check (with layered function).

(6) Can provide relevant measurement information, used to evaluate the production process. Such as solder paste thickness, solder joints under the amount of solder.


Training
Training will include:

Basic Radiation Safety.
X-Ray system control functions.
X-Ray image processing software training.
Basic X-ray signature analysis training.
Hands-on sample analysis using your typical samples.
Training certificates for all attendees.


Inspection Images:
































China BGA Modern X Ray Machine Strong Penetration For Electrical Components for sale

BGA Modern X Ray Machine Strong Penetration For Electrical Components

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